IC Packaging Design Engineer
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Hi,Please find the new opening from INTEL.Here is the below JD for your reference IC Packaging Design EngineerLocation: Chandler, AZ or Hillsboro, OR (ONSITE)Longterm Contract – 1 Year +Skills Required Bachelor’s or Master’s degree in Electrical /Electronics EngineeringExperience: Strong hands-on experience in Siemens (Mentor) Xpedition (XPD); Alternatively: Cadence Allegro/Advanced Package Designer (APD / SiP)Candidates should have experience in the below domains:Physical Design & LayoutSubstrate design and layoutSI/PI aware design implementationDesign for performance, manufacturability, yield, and reliabilityDesign rule compliance