Advanced Packaging Development Engineer

Job Description:Broadcom is a leading semiconductor company with rapid growing business in the AI accelerator and networking chips. We are hiring a talent to develop and enable advanced packaging technology to integrate memory dies and SoC dies into one package for AI related products.Key job scope includes packaging technology roadmap future product needs for 3-5 years support development of key components (HBM, iVR, Si Cap) for advanced packaging manage reliability test to qualify new technology lead yield improvement activities for new technology ramp-upThe job requires intensive experience in related area - such as 2.5D/3D and HBM technology development and reliability/yield improvements. Project management and team work skills are required. Strength in technology innovation, development, and enablement are key factors to consider.A M.S. degree in related engineering field with at least 10 years (post degree) of direct experience (or 7 years with a Ph.D. degree) is required.Additional Job Description:Compensation And BenefitsThe annual base salary range for this position is $127,100 - $203,400This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.R026099