Process Engineering Technician (Plating) (50356)

TITLE: PLATING PROCESS TECHNICIAN FLSA STATUS: NON-EXEMPT A SHIFT: MONDAY TO WEDNESDAY AND EVERY OTHER THURSDAY,6:00AM-6:00PM REPORTS TO: DIRECTOR, PLATING PROCESS ENGINEERING SUMMARY: Under the direction of the Manager of Plating Process Engineering, the Plating Process Technician provides support to the engineering teams in the plating area, including assisting with wet etch process, preparing and maintaining recipes, reviewing and documenting process or procedures, and expediting and dispositioning prototype wafers; maintains process controls using Statistical Process Control (SPC), collects and analyzes data, and recommends corrective action. This position is located in Milpitas, California. ESSENTIAL FUNCTIONS:Provides support to the engineering teams in the plating, wet etch, and stripping process areasSupports the plating, wet etch, and stripping processes by preparing, maintaining, and setting up recipes to ensure an efficient and consistent processReviews and documents processes and procedures; partners with engineering to implement changes effectivelyExpedites and dispositions prototype wafers in the plating, wet etch and stripping areasAssists engineers to run plating process development experiments, collects and analyzes data, and recommends corrective action if requiredReviews and maintains process controls using SPC and prepares charts and graphsAssists with routine troubleshooting and resolves basic process-related issuesParticipates in and recommends modifications to procedures or processes in support of continuous improvement initiativesCollaborates with Engineering to qualify or approve new processes or proceduresCreates reports, charts, or graphs on an ad-hoc or routine basisPrepares daily pass down report for engineers, next shift plating process technicians, and manufacturing plating techniciansResponds to inquiries from other team members, managers, or departmentsAdheres to all safety policies and procedures as requiredPerforms other duties of a similar nature or level* MINIMUM QUALIFICATIONS:Associates degree in Electronics or Industrial Technology and/or equivalent relevant experienceTwo years of experience working in the semiconductor industryKnowledge of plating, wet processes and proceduresHands on experience using metrology tools such as pH meter, Tencor Thickness Profiler, XRF, and B-H loop toolsProficient in the use of Microsoft Office Applications Required Knowledge, Skills, and Abilities:Knowledge of semiconductor or hard disk drive (HDD) principles and processesKnowledge and ability to use SPC to maintain process controlsKnowledge of plating, wet processes and proceduresAbility to collect and analyze data, present findings, and recommend corrective actionAbility to adhere to all safety policies and proceduresAbility to communicate effectively with all levels of employees and managementDemonstrated ability to follow routine verbal or written instructionsDemonstrated problem solving and organizational skillsDemonstrated time management and prioritization skillsSkilled at resolving issues quickly and efficientlyFlexible and able to prioritize The hourly rate for this full-time position is between $26.00-$35.00 + bonus target + benefits. Within the range the individual pay may differ depending on additional factors including job responsibilities, job related knowledge, skills, abilities, education, and experience. The hourly pay range shown is subject to change and may be modified periodically. WORKING CONDITIONS: The Plating Process Technician works primarily in an indoor environment on a rotating schedule (A, B, C, or D shift). The schedule may be altered from time-to-time to meet business or operational needs; may travel from building-to-building as needed. Works in a class 100 ESD sensitive wafer manufacturing facility; wears a cleanroom (bunny) suit, including hood, gloves, safety glasses, booties, and mask. May be exposed to hazardous conditions, chemicals, fumes, and/or gases during the course of workday; Stands and walks; performs various fine grasping movements, bends, and twists; operates a computer and enters information using a keyboard, operates a telephone, and other office equipment. Must be able to load and unload various wet etch chemical solutions several times per shift. May be required to push, pull, or lift up to 25 pounds. *Other duties of a similar nature or level are duties that may be required but may not be specifically listed in the job description or posting. TDK/Headway Technologies, Inc. provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, religion, gender, national origin, age, disability, or genetics. Applicants requiring accommodation in order to complete the application process should contact the Headway Human Resources Department.