Senior Lead Memory Circuit Design Engineer (Mixed-Signal / NVM)

Senior Lead Memory Circuit Design Engineer (Mixed-Signal / NVM)Location: Mesa, ArizonaPay: $150,000.00 - $200,000.00 per yearJob description:Senior Lead Memory Circuit Design Engineer (Mixed-Signal / NVM)Numem is a California- and Arizona-based company that transforms next-generation memory technologies to power AI applications at the edge and data center. Our solutions deliver ultra-low latency, low power, and optimized density to meet the performance demands of modern AI workloads. We specialize in advancing founder-based MRAM technologies, enhanced through state-of-the-art innovations in design, sense, power efficiency, and performance optimization, enabling a broad range of applications across edge and data-center environments.This job req seeks Arizona site as strict preference.Role SummaryWe are seeking a Senior Lead Memory Circuit Design Engineer to take end-to-end ownership of a production-grade memory subsystem in an advanced mixed-signal SoC. This role drives architecture-to-tapeout execution across memory arrays, read/write circuitry, sensing, reference generation, and datapath integration. The successful candidate will collaborate closely with Analog, Digital/RTL, Verification, and Layout teams and will mentor junior engineers to deliver schedule-driven milestones through multiple tapeouts.Key ResponsibilitiesOwn full memory subsystem delivery from specification, architecture, circuit design, verification, and signoff to tapeout.Define and refine memory block requirements (performance, power, robustness, testability) aligned to full-chip specifications.Circuit verification planning: SPICE testbenches, PVT/temperature sweeps, Monte Carlo, mismatch, and reliability checks.Review Chip level STA timing violations related to the memoryImplement Margin measuresWaveform Review and Document the summary and findingsPartner with Layout on floorplan constraints, parasitic-aware design, EM/IR, density/fill, antenna, and signoff closure.Coordinate cross-functional reviews, manage risks, and mentor junior engineers to achieve development milestones.Required QualificationsBSEE/MSEE/PhD (or equivalent experience) in Electrical Engineering or related field.15+ years of memory circuit design experience including SRAM and non-volatile memory technologies.Proven record of multiple successful tapeouts with block or subsystem ownership.Deep expertise in mixed-signal design fundamentals and memory read/write design tradeoffs.Strong experience with sense amplifier design, reference generation, and variation-aware margin analysis.Strong understanding of array architecture, disturb mechanisms, and robustness techniques (generalized, not technology-specific).Experience with address decoders, timing/control sequencing, and datapath integration.Hands-on proficiency with Cadence and Synopsys design flows and SPICE-class simulation tools (PrimeSim/HSPICE/Spectre).Ability to lead cross-functional execution and mentor engineers while maintaining quality and schedule.Preferred QualificationsExperience with advanced non-volatile and resistive memory architectures, including crosspoint-style arrays.Prior work on MRAM and/or RRAM designs, silicon characterization, and post-silicon debug is desirableExperience with reliability signoff considerations (EM/IR, ESD, latch-up, safe operating area) as they apply to memory macros.Tools & MethodsSimulation: PrimeSim/HSPICE/Spectre (or equivalent), waveform/debug, sweep automation.Design: Cadence Virtuoso / Custom Compiler; mixed-signal schematic capture and integration workflows.Verification: scripting for regression, corner/Monte Carlo automation, and results reporting (Python/TCL/Shell).Collaboration: clear documentation (specs, verification plans, acceptance tests, signoff reports).What Success Looks LikeMemory subsystem meets product goals with documented margins across PVT/temperature and robust standby/read/write behavior.Clean signoff closure with traceable acceptance tests and tapeout-ready deliverables.Effective coordination across analog/digital/layout/verification teams and strong mentoring of junior engineers.Predictable execution aligned to program milestones with risks identified early and mitigations implemented.To apply: submit your resume plus a short summary of memory products/tapeouts, key blocks owned (sensing, references, drivers, arrays), and any post-silicon bring-up or characterization experience.Job Type: Full-timeBenefits:Dental insuranceHealth insurancePaid time offVision insuranceWork Location: In person