IC Package Thermal-Mechanical Engineer: Advanced Simulation
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Broadcom Inc. is seeking an IC Package Thermal Mechanical Engineer in Irvine, CA to focus on mechanical design and thermo-mechanical simulation of semiconductor packages. This role involves leveraging advanced simulations and hands-on lab experiments to optimize product reliability and yield.
Candidates should have a relevant degree and extensive industry experience. The position offers competitive salary and benefits, emphasizing equal opportunity for all applicants.
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