Lead Advanced Packaging Integration Technologist

EMD Electronics in Tempe, Arizona is seeking a talented professional to develop strategies for High Performance Packaging. You will connect with key business units, driving product development from concept to high volume manufacturing. The ideal candidate has an MSc or higher in Engineering and over 10 years of R&D experience with Advanced Packaging tools. The position includes a competitive salary and various benefits, including health insurance and paid time off. #J-18808-Ljbffr