Failure Analysis Engineer

Failure Analysis EngineerOverviewAn innovative engineering company in Austin, Texas is seeking a skilled Failure Analysis Engineer to join its advanced thermoelectric engineering team. This role is responsible for investigating product failures through physical and electrical analysis, identifying root causes, and partnering with engineering teams to improve product reliability, manufacturing processes, and yield.The ideal candidate has hands-on semiconductor failure analysis experience and is comfortable using advanced analytical tools such as FIB/SEM while leading complex technical investigations.ResponsibilitiesPrepare metallographic samples through cross-sectioning, polishing, grinding, and lapping to evaluate material microstructures.Perform electrical probing alongside physical characterization techniques, including optical microscopy and scanning electron microscopy (SEM), to identify failure mechanisms.Conduct focused ion beam (FIB) cross-sectioning, SEM imaging, and energy-dispersive spectroscopy (EDS) analysis on thin-film devices and process monitor samples.Lead failure investigations by developing hypotheses, selecting appropriate analytical methods, and driving root cause identification.Correlate physical and structural findings with electrical characterization data, including IV curves, resistance, and impedance measurements.Document findings in clear technical reports with actionable recommendations for process and product improvements.Work closely with process, manufacturing, and device engineering teams to implement corrective actions that improve product yield and reliability.Coordinate analytical testing with external university laboratories, including scheduling access to FIB/SEM, AFM, and other specialized equipment.Manage sample logistics and serve as the primary technical liaison with university nanofabrication and characterization facilities.QualificationsBachelor's degree in Mechanical Engineering, Electrical Engineering, Materials Science, or a related engineering discipline (Master's degree preferred).3+ years of semiconductor failure analysis experience using FIB/SEM systems.Experience with additional analytical techniques such as AFM, EDS, EBSD, or similar characterization tools is preferred.Strong understanding of semiconductor devices, materials characterization, and root cause analysis methodologies.Excellent analytical and problem-solving skills with strong attention to detail.Strong technical writing and verbal communication skills.Comfortable working in a fast-paced engineering environment with occasional weekend support when needed.BenefitsCompetitive salaryMedical, dental, and vision insurance401(k) with company benefitsPaid time off (PTO)Opportunity to work on cutting-edge semiconductor and thermoelectric technologies in a collaborative engineering environment