FEOL RET Process Development Engineer

Overview In this role, you translate customer design intent into manufacturable layouts using advanced retargeting techniques to optimize yield, performance and manufacturability across advanced nodes. You will collaborate with OPC, lithography and process teams to ensure accurate pattern transfer and robust design rules. You’ll analyze and modify layouts, automate retargeting flows in the tape-out pipeline, and support design enablement with manufacturability guidance. This position offers impact by shaping retargeting strategies for 28nm/22nm nodes within TI’s RET team, contributing to scalable, high-yield manufacturing. Compensation / Benefitscompetitive paybenefits designed for you and your familyfocus on well-beingcountry-specific benefits available ResponsibilitiesDevelop and implement design retargeting strategies aligning design intent with process capabilitiesCollaborate with OPC, lithography and process integration teams for reliable pattern transfer and high-yield manufacturingAnalyze and modify layout geometries to improve printability and process window robustnessAutomate retargeting flows using EDA tools and integrate into the tape-out pipelineProvide feedback on layout constraints and manufacturability guidelines to support customer design enablementPerform data analysis using CD metrology, SEM review, and simulations to refine retargeting rulesContribute to design rules and patterning strategies for advanced nodes (28nm, 22nm)Mentor junior engineers and share knowledge within the team Key requirementsMaster's degree in Electrical Engineering, Physics, Materials Science, or related field5+ years of experience in design retargeting, OPC, or physical design in semiconductor/EDA environmentsStrong understanding of optical lithography, RET concepts, and mask technologyHands-on experience with OPC tools (e.g., Synopsis Sentaurus Lithography, Mentor Calibre, ASML Brion)Proficiency in scripting and automationFamiliarity with layout editing/verification tools (Calibre, Virtuoso, ICC2)Understanding of lithography, patterning, and process integration challenges in advanced nodesExperience with 28nm and belowstrong analytical and problem-solving abilitiesexcellent communication and cross-functional collaborationmentorship and knowledge-sharingOPC/RET flowslithography principlesEDA tooling (Calibre, Virtuoso, ICC2)