Laser packaging process engineer

BluGlass Inc is advancing III‑nitride semiconductor laser technology and high‑reliability laser diode products. At our Nashua, NH site, we integrate materials science, packaging engineering, and manufacturing to deliver next‑generation lasers for industrial, medical, and scientific applications. We are seeking a Process Engineer to own and optimize the end‑to‑end laser diode packaging process—from QA and die handling/cleave through die bond, wire bond, capping/seal, and final test—supporting a high‑mix, high‑volume production environment. Role Summary Lead process development, optimization, qualification, and transfer to production for laser diode packaging flows (die prep, attach, wirebond, cap/cover, fiber attach, test). Ensure reliability, performance, and manufacturability across multiple product families (including butterfly packages and fiber bonding). Key Responsibilities Packaging Flow Ownership: Define standards, work instructions, and critical parameters for QA, die handling/break, die bond, wirebond, capping, and test; implement SPC/DOE for robustness and yield. Recipe & Equipment Process Development: Develop and maintain per‑equipment recipes (auto die bonders, wire bonders, lid/cap sealers, laser soldering/reflow, fiber attach) tailored to different product requirements; document and version‑control changes. Equipment Maintenance & Calibration: Establish calibration schedules, PMs, and verification procedures; keep tools updated and operational; partner with vendors for upgrades. Continuous Improvement: Increase efficiency, throughput, and first‑pass yield via cycle‑time reduction, process simplification, and automation; drive data‑driven kaizen initiatives. High‑Mix/High‑Volume Readiness: Build scalable processes that meet the ongoing demand for many product variants with differing requirements; design flexible fixturing, tooling, and recipes. Reliability & Qualification: Plan and execute HAST, HTOL, thermal cycling, vibration, and power aging; develop lifetime models (e.g., Weibull/log‑normal), define pass/fail criteria, and own qualification reports. Failure Analysis: Lead root‑cause investigations using SEM/EDS/X‑ray, cross‑sections, optical/electrical diagnostics; implement CAPA and feed learnings into design and process updates. Data Analysis & Automation: Write robust Python code to ingest, process, and model production/test data; build dashboards in Power BI; maintain version‑controlled analysis pipelines; apply DOE/SPC. Materials & Device Physics: Apply semiconductor packaging and laser device fundamentals (III‑nitride, IMC control, thermal management, metallurgy) to interpret performance and guide improvements. Tooling/Fixtures: Design jigs and fixtures; collaborate with Mechanical Engineering on CAD, tolerances, and manufacturability; validate and release to production. Electrical & Controls: Contribute to control/feedback systems, safety interlocks, and driver interfaces; design/review PCBs for test and control where needed; support equipment IO integration. Equipment Setup & Refurbishment: Install and qualify new tools (e.g., butterfly line, fiber bonding); refurbish and debug semi‑auto die bond/wirebond equipment as needed; author SOPs and training. Cross‑Functional Collaboration: Work with design, materials, reliability, manufacturing, and operations teams to align processes with product requirements; support NPI and ramp. Instruments & Tools (examples) Auto/semi‑auto die bonders and wire bonders; cap/lid seal equipment; fiber attach/bonding stations. Ovens/reflow/laser soldering; environmental chambers; motion/positioning systems. Optical spectrum analyzers, power meters, beam profilers; SMUs, oscilloscopes, LCR meters; X‑ray/SEM/EDS. Qualifications Bachelor’s or Master’s in Materials Science, Electrical/Mechanical Engineering, or related field; 5+ years in semiconductor packaging (must‑have), optoelectronics, or power electronics. Hands‑on experience with auto die bond and wirebond tools; setup, operation, and process recipe development; preferred experience refurbishing semi‑auto tools. Proven track record in reliability testing (HAST/HTOL) and lifetime modeling; familiarity with IPC/JEDEC reliability standards. Strong programming skills in Python and data visualization in Power BI; capable of writing production‑grade code for data processing and statistical analysis (DOE/SPC). Background in electrical engineering and automation (controls/feedback, interlocks, PCB design) is preferred. Excellent problem‑solving, communication, and project management; thrives in high‑mix, high‑volume environments. Location On‑site in Nashua, NH, primarily in lab/manufacturing areas; limited travel to vendors/partners. Compensation & Benefits Competitive salary commensurate with experience; eligible for annual bonus and equity, as applicable. Comprehensive benefits including medical, dental, vision (with HSA/FSA options), paid life/AD&D, short‑/long‑term disability, paid holidays, vacation/sick time, 401(k) with match, ESPP, tuition reimbursement, EAP, and parental leave. Program eligibility may vary by schedule. How to Apply This posting remains active until filled or closed. For full consideration, submit your application; candidates needing alternative methods of application or screening should contact BluGlass directly. Pay: $95,000.00 - $125,000.00 per year Benefits: 401(k) 401(k) matching Dental insurance Flexible spending account Health insurance Health savings account Paid time off Vision insurance Work Location: In person