Packaging Module Equipment Development Engineer

Overview In this role you will drive the development and optimization of assembly processes and equipment to enable next-generation packaging solutions. You’ll work within Intel's Packaging Module Development team to improve manufacturing efficiency, reliability, and innovation across the product portfolio. You will apply DOE and SPC to refine processes, support new materials and architectures, and lead continuous improvement initiatives. This is a chance to shape high-volume manufacturing with cross-functional teams at a global tech leader. Compensation / Benefitscompetitive paystock bonuseshealth benefitsretirement plansvacationcareer development programs ResponsibilitiesDevelop and optimize assembly processes and equipment to meet quality, reliability, cost, yield, productivity, and manufacturability goalsApply Design of Experiments (DOE) and statistical methods to refine processes and equipment capabilities, documenting findingsEnsure manufacturability of package designs and oversee equipment health and reliability from development to high-volume manufacturingSupport integration of new materials and architectures into equipment for manufacturing success for advanced foundry customer product manufacturabilityInnovate techniques, tools, and quality screens to proactively address equipment health and reliabilityLead problem-solving initiatives and continuous improvement for processes and equipmentStandardize equipment qualification practices and manufacturing quality systems aligned with product milestones Key requirementsBachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 2+ years of relevant experience OR Master's with 1+ years OR PhDProficiency in Statistical Process Control (SPC) and Design of Experiments (DOE) principlesleadership of technical innovationcross-functional collaborationstrong problem-solving abilitiesDOESPChigh-volume manufacturing experience