Sr. Principal Plating Engineer

Overview As a Sr. Principal Plating Engineer, you lead advanced electroplating and metallurgical research for MEMS probe fabrication. You shape technology roadmaps, drive material development, and guide cross-functional teams to enhance probe card performance. You balance long-term innovation with hands-on process characterization to strengthen FormFactor’s technology leadership. This role offers impact across R&D, product direction, and manufacturability in a collaborative, high-performance culture. Compensation / Benefitsmedical, dental, visionlife insurancedisability coverage401(k) with company matchemployee stock purchase plan (ESPP)paid time off ResponsibilitiesDefine long-range technology roadmaps for advanced electroplating processes and metallurgical innovations in MEMS probesServe as SME in electroplating, electroless deposition, electrochemistry, and related process developmentLead evaluation and implementation of new materials and deposition tech to improve electrical, thermal, mechanical, and reliability performanceAssess emerging technologies to create competitive advantages through advanced materials and platingGenerate intellectual property through invention disclosures and patent developmentDesign and execute complex DOE to optimize metallurgical solutions for MEMS fabricationDevelop, characterize, document, and scale electrodeposition processes for vertical probe technologiesEstablish process windows, specs, and control methodologies for robust manufacturingLead process integration across MEMS fabrication workflowsMaintain expertise in plating bath chemistry, deposit morphology, stress, grain structure, and material optimizationPerform advanced materials characterization (SEM, EDS/EDAX, FIB) and analyze metal structuresLead root cause investigations on defects, excursions, reliability, and manufacturing challengesApply first-principles engineering and statistical methods to electrochemical and materials issuesDevelop advanced process monitoring, control, and qualification methodologiesEstablish analytical techniques for plating bath characterization and chemical managementDrive improvements in yield, process capability, throughput, and robustnessDefine best practices for electrochemical process control, safety, and materials handlingEnsure compliance with environmental, health, and safety standards Key requirements8+ years of related experience with a Bachelor's degree; or 6 years with a Master; or PhD with 3 yearsexpertise in electroplating, electroless deposition, electrochemistry, and metallurgical process developmentexperience with MEMS or semiconductor fabricationstrong problem-solving using first-principles and statisticsability to lead cross-functional projects and mentor othersexperience with SEM, EDS/EDAX, FIB is a pluscross-functional collaborationleadership and mentorshiptechnical communication to senior leadershipElectrochemistryElectroless PlatingElectron Microscopy (SEM)