Dry Etch Process Development Engineer
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Overview:
In this role you drive continual improvement in semiconductor process development at TI. You will develop and optimize processes, define equipment needs, and support manufacturing from concept to full-scale production. Your work focuses on improving yield, quality, and production efficiency through data-driven methods. You will collaborate with cross-functional teams and vendors to advance process roadmaps and technology, contributing to TI’s mission to make electronics more reliable and affordable. This is a hands-on role with a strong impact on manufacturing performance.
Compensation / Benefitscompetitive pay and benefitswell-being programscountry-specific benefits
Responsibilities:
Develop new or modified processes and specify equipment and methods for manufactureParticipate from paper study to full-scale manufacturing as neededCompile and evaluate test data to define process/material specificationsPlan projects involving new concepts, equipment, and automation for processingProvide technical engineering support in manufacturingRecommend and implement equipment and process changes to boost yields and production efficiencyDevelop and conduct DOE and SPC analyses to target failure causes and improve qualityCollaborate with vendors to define and execute equipment and process roadmaps
Key requirements:
Master’s degree in a related field 5 years relevant experience in 300mm Dry EtchStrong foundation in SPC, DOE, data analysis, model-based problem solving, engineering change control, and process release strategiesteam collaborationinitiative and result-drivenstrong communication (verbal and written)DOESPCdata analysis