Advance Packaging Engineer

Piper Companies is seeking an Advanced Packaging Engineer to support a leading organization in the semiconductor and high-performance computing industry. The Advanced Packaging Engineer will play a critical role in next-generation single-chip, SoC, and multi-component module packaging technologies, including CoWoS, 2.5D, and emerging 3D/TSV-based integration. Responsibilities of the Advanced Packaging Engineer Drive development of advanced single-chip flip-chip packaging and complex SoC/multi-component module assemblies. Lead design, analysis, and integration efforts for CoWoS, 2.5D, and early-stage 3D/TSV packaging solutions. Develop and optimize organic substrate architectures for high-density, high-performance applications (critical must-have). Collaborate with foundry partners, including TSMC, to support system-on-wafer packaging technology. Qualifications of the Advanced Packaging Engineer 5+ years of experience in advanced semiconductor packaging engineering. Strong technical background in single-chip flip-chip packaging and SoC/multi-component module integration. Hands-on expertise with CoWoS, 2.5D, and exposure to 3D/TSV packaging methodologies. Deep understanding of organic substrate technology-this is a mandatory requirement. Experience collaborating with TSMC on system-on-wafer development. Knowledge of thermal, mechanical, and reliability modeling tools and best practices. Compensation for the Advanced Packaging Engineer includes Salary range: $200,000 - $220,000 depending on experience Comprehensive benefits package including medical, dental, vision, 401(k), and PTO This job opens for applications on 04/16/2026. Applications for this job will be accepted for at least 30 days from the posting date. LI-JN1 ONSITE