Packaging Reliability Lab Engineer: Advanced Packaging Tech

Intel’s Stress Testing and Reliability Laboratory seeks an experienced engineer to join the Environmental Stress Tool Engineering team in Arizona. You will advance packaging technologies (EMIB, Foveros, Hybrid Bonding, Co‑Packaged Optics) and support qualification and development efforts, operating advanced stress systems to produce reliable data for process decisions. The role emphasizes integration of measurement, automation, and calibration, with collaboration across operations, planning, and #J-18808-Ljbffr