Sr Mechanical Engineer - Electronics Packaging

Basic Qualifications Bachelors degree in Mechanical Engineering or Electro-Mechanical Engineering from an ABET accredited University 8+ years experience in mechanical packaging of electronic components or systems Experienced designing for electronics manufacturing processes (such as SMT, PCB fabrication, polymerics application, applicable solder chemistries, etc.) Working knowledge of the electronics product development process Basic working knowledge of GD&T Experienced working in schedule driven, multi-disciplinary project teams US Citizenship and the ability to hold a US government clearanceJob DescriptionSpace is a critical domain, connecting our technologies, our security and our humanity. While others view space as a destination, we see it as a realm of possibilities, where we can do more — we can innovate, invest, inspire and integrate our capabilities to transform the future.At Lockheed Martin Space, we aim to harness the full potential of space to cultivate innovation, reduce costs, and push the boundaries of what technology can achieve. We’re creating future-ready solutions, focusing on resiliency and urgency through our 21st Century Security® vision. We’re erasing boundaries and forming partnerships across industries and around the world. We’re advancing spacecraft and the workforce to fuel the next generation. And we’re reimagining how space can connect us, ensuring security and prosperity.Join us in shaping a new era in space and find a career that's built for you.Lockheed Martin Space is seeking a Senior Mechanical Engineer experienced in electronics packaging.Roles & Responsibilities 3D CAD (Creo) design and drafting of mechanical/electro-mechanical components and assemblies with a focus on design for reliability, manufacturing, and ruggedization. Perform engineering analyses: thermal, structural, tolerance stack-ups. Designing and conducting laboratory experiments to evaluate material selections and/or advanced electronic packaging manufacturing processes. Collaborate across engineering disciplines to accomplish project tasks/objectives Develop engineering qualification plans for requirements and workmanship verification. Identify technical risks and develop risk mitigation options with technical project team; Present options/solutions to project management.Desired Skills Active TS/SCI security clearance Master’s Degree with concentration in Electronics Packaging, Microelectronics, or Electronics Process Development Experienced designing for microelectronics manufacturing processes Experienced designing for space electronics packaging Experienced developing process maps, work instructions, and process documentationOther Important InformationBy applying to this job, you are expressing interest in this position and could be considered for other career opportunities where similar skills and requirements have been identified as a match. Should this match be identified you may be contacted for this and future openings.Ability to work remotelyOnsite Full-time: The work associated with this position will be performed onsite at a designated Lockheed Martin facility.