Senior Technical Solutions Engineer - Advanced Packaging
About Intel FoundryIntel Foundry is revolutionizing the semiconductor industry as a leading systems foundry, delivering breakthrough silicon process and packaging technologies for the AI era. We combine industry-leading technology, extensive IP portfolio, world-class design ecosystem, and a resilient global manufacturing supply chain to drive scalability and innovation.Job OpportunityJoin Intel Foundry Services as a Senior Technical Solutions Engineer – Advanced Packaging and become the cornerstone of customer success for our key Packaging and Test accounts. This role combines technical expertise with customer relationship management to drive adoption of Intel's advanced technology solutions, including our cutting-edge Advanced Packaging capabilities.ResponsibilitiesCustomer Relationship LeadershipServe as the primary customer interface, building trust and ensuring seamless communication throughout all engagement phases.Act as the Voice of the Customer within Intel Foundry, advocating for customer priorities and expectations across all internal functions.Technical Consultation & Problem-SolvingPartner directly with customers to understand packaging challenges and requirements.Provide expert technical consultation on packaging solutions and processes.Connect customers with Intel Foundry's technical experts for specialized insights.Cross-Functional CollaborationWork with Technology Development, Product Engineering, Manufacturing, Operations, and Customer Engineering teams.Influence product and technology roadmaps through customer feedback and market insights.Coordinate internal Intel resources to ensure customer success.Program Management & ExecutionDevelop and maintain comprehensive Statements of Work (SOW) documenting requirements, commitments, deliverables, and milestones.Manage complete customer engagement lifecycle from design award through high-volume manufacturing and end-of-life.Track commitments, action items, and escalations while monitoring risks and dependencies.Drive resolution of qualification and delivery issues.Communication & ReportingProvide clear, regular status reports to customers and leadership.Facilitate effective communication between technical and business stakeholders.Core CompetenciesStrong communication skills.Ability to navigate both technical and operational discussions effectively.Strong problem-solving and analytical thinking capabilities.Talent for explaining complex technical concepts clearly and concisely.QualificationsBachelor's degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or a related field.5+ years of experience in one or more of the following: Semiconductor Packaging, Assembly/Test, Backend Manufacturing, Operations, Product Engineering, Field Applications, or customer-facing engineering roles.8+ years of semiconductor experience.Post-graduate degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or a related field.Experience in Advanced Packaging Technologies including 2.5D/3D, Chiplets, HBM, HSIO, SiP, Power Delivery, and Thermal Management.Experience with Advanced Package Manufacturing, Bumping, Assembly, and Test processes.Experience with DOE, FMEA, yield analysis, and failure analysis methodologies.Project management and customer-facing experience.Flexibility for travel as needed.Job TypeExperienced HireShiftShift 1 (United States of America)Primary LocationUS, Arizona, PhoenixAdditional LocationsUS, California, FolsomUS, California, Santa ClaraUS, Oregon, HillsboroUS, Texas, AustinPosting StatementAll qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.BenefitsWe offer a total compensation package that ranks among the best in the industry, including competitive pay, stock bonuses, and benefit programs such as health, retirement, and vacation. Annual salary range for US locations: $160,980.00 - $311,040.00 USD.Work ModelThis role will be eligible for our hybrid work model, allowing employees to split their time between working on-site at their assigned Intel site and off-site.Responsible Hiring PracticesIntel is committed to Responsible Business Alliance compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.J-18808-Ljbffr