Lead Engineer, Advanced Packaging
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Micron Technology, Inc is seeking a Principal Thin Films Engineer to lead development in advanced packaging technology.
In this role, you will develop and optimize thin film processes, collaborating with teams to drive innovative solutions for Micron's memory products. Candidates should possess 7+ years of experience and a relevant MS or PhD.
We offer competitive benefits that support your wellbeing and professional growth, including healthcare plans, paid time off, and more.
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