Senior IC Packaging & SI Architect - Remote

photonics engineers

computer hardware engineers

microsystems engineers

encore semi llc

specialty food retailers beverage manufacturing

Dayton, OH

March 26th, 2026

A leading semiconductor technology firm is seeking a Sr Package Design & Electrical Analysis Engineer to drive the physical architecture of high-performance silicon remotely. The role requires over 10 years in package design, focused on ensuring integrity in advanced ASIC designs. Ideal candidates possess strong electrical engineering backgrounds and experience with simulation tools. The position offers a competitive salary between $150,000 and $165,000, along with extensive benefits including medical, dental, PTO, and 401k options. J-18808-Ljbffr

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