Sr. Manager Packaging Engineering

Overview As Package Design Lead, you will drive the end-to-end design and execution of next-generation Data Center GPU and MI package programs. You will lead cross-functional teams, manage milestones, risks, and senior stakeholder communication to deliver high-performance, scalable packaging solutions. Your work will shape how AMD meets aggressive timelines and technical goals in a fast-paced environment. You will champion AI-assisted design methods and automation to boost productivity. This role offers high impact by advancing data center technologies and enabling cutting-edge AI workloads. ResponsibilitiesLead end-to-end execution of multiple Data Center GPU/MI package design programs with focus on schedule, quality, and costManage fast-paced, high-pressure programs with competing priorities and interdependenciesEstablish execution frameworks: milestones, risk management, readiness gatesProvide clear program status, risks, and mitigations to senior leadershipMentor and grow a geographically dispersed team of package design engineersFoster accountability, innovation, and continuous improvement within the engineering cultureCollaborate with silicon, SI/PI, thermal, mechanical, and manufacturing teams to ensure design convergenceEngage OSATs and substrate vendors to optimize manufacturability and yieldDefine and drive improved design methodologies, workflows, and best practicesChampion AI/ML-enabled tools and automation to enhance productivity and decision-makingScale digital transformation initiatives within the package design organization Key requirementsExperience in semiconductor package design with focus on high-performance or data center productsProven track record leading teams and delivering multiple complex projects in fast-paced settingsStrong understanding of package layout, high-speed design considerations, and multi-die integrationExperience with AI/ML applications in engineering workflows (design automation, data analytics, optimization)Excellent leadership, communication, and stakeholder management skillsAbility to handle ambiguity, make decisions, and perform under pressureExperience working with OSATs, substrate vendors, and manufacturing partnersHands-on experience with industry tools such as Synopsys 3DICC, Cadence SiP / APD or equivalentExperience in Data Center GPU, HPC, or advanced packaging technologies (chiplets, 2.5D/3D)leadershipcommunicationstakeholder managementAI/ML in engineering workflowsdesign automationlayout optimization