HBI Module Development Engineer

Job Description The Role and Impact As a Senior HBI Module Development Engineer for Die-to-Wafer Hybrid Bonding (HBI), you will drive equipment development and manufacturability for next-generation hybrid bonding technologies, enabling Intel's leadership in advanced packaging for high-performance computing, AI, and chiplet architectures. You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both first-of-a-kind (FOK) platform development and optimization of manufacturing processes to support development and high-volume manufacturing environments. Your work will directly impact module-level performance, yield, reliability, and operational efficiency while helping shape Intel's future hybrid bonding technology roadmap. Key Responsibilities • Drive process and/or equipment manufacturing development for die-to-wafer hybrid bonding, including parameter optimization, equipment characterization, and process control. • Develop and optimize manufacturing processes to improve yield, reliability, and defectivity performance. • Improve bond interface quality, alignment performance, overlay accuracy, surface preparation, and contamination control. • Design and execute DOE-based experiments and perform statistical analysis to establish robust process windows and control strategies. • Lead first-of-a-kind (FOK) process and equipment capability development for new bonding platforms and technologies. • Identify and implement process and equipment improvements to enhance manufacturing capability, efficiency, and output. • Conduct process feasibility studies using characterization, modeling, simulation, and experimental methodologies. • Partner with equipment suppliers and materials vendors to develop enabling process and hardware solutions. • Collaborate with technology development, process integration, and manufacturing organizations to drive process maturity and continuous improvement. • Contribute to future technology roadma...