Quantum IC Substrate Layout Engineer (2.5D/3D Packaging)

Intel Corporation's Quantum Computing Group in Hillsboro, Oregon seeks a Quantum IC Substrate Package Layout Design Engineer to design large form factor IC substrates within a multidisciplinary team, advancing silicon quantum dot technology. You will use Siemens Xpedition, conduct DRC/LVS, support 2.5D/3D packaging, tapeouts with suppliers, and communicate designs to stakeholders while staying current with packaging trends.