<Back to Search
Spintronic Device Scientist
Eden Prairie, MNMarch 25th, 2026
The JobDeveloping new spintronic devices to extend NVEs industry leadership.Detailed duties include:Develop advanced spintronic devices using physical vapor deposition, wafer fabrication methods, and device characterization techniques.Create models of device performance using basic physics principles, micromagnetic simulation tools, and multiphysics simulation software.Integrate new spintronic materials into unique wafer fabrication processes.Collaborate with technical support staff to complete experiments, maintain equipment, and transition new technologies into high-volume production.Identify failure mechanisms and customer quality issues, and incorporate corrective actions into device materials and fabrication flows.Present research findings to customers, external researchers, and internal review teams..Education and SkillsM.S. or Ph.D. in physics, materials science, electrical engineering, or related field.Experience analyzing magnetic materials and devices using techniques such as magnetometry, electronic transport, magnetic microscopy, or X-ray analysis.Knowledge of vacuum deposition, semiconductor photolithography, and etch equipment.Expertise in magnetic thin-film device physics, including xMR, voltage-controlled anisotropy, spin-orbit torque, and multiferroic materials, is a plus.Demonstrated exceptional problem-solving and experimental design abilities.Strong work ethic and leadership skills.Results oriented.Pay Range$80,000 to $115,000/year.
Showing 50 of 2,515 matching similar jobs
- Process Engineer
- Chief Scientist, Photonic Integrated Circuit Process Development - QPIC
- Senior Foundry Device Engineer
- Process Engineer IV - (E4)
- FIB Technician
- Research Engineer II- Semiconductor Fabrication and Advanced Packaging
- Packaging Engineer
- Senior Process Engineer - Plasma
- FIB Technician
- Staff Engineer, MEMS Process Development
- Process Technician - Night Shift
- Engineer- Development II (Reliability Physics)
- SiC Power Device Research Scientist - Design
- Process Integration Engineer
- Process/Integration/Device Engineering - Summer/ Fall Co-Op (San Jose, CA, US)
- Technologist - Research & Development
- Advanced Optical Component Design and Characterization Researcher
- Packaging Engineer
- Senior Packaging Engineer
- Packaging Engineer
- Staff Engineer, MEMS Process Development
- Senior Packaging Engineer
- Application Engineer
- Senior Spine Device Engineer - CREO, FDA & Leadership
- Sr Scientist, R&D - Packaging Dev
- Process Integration Engineer
- Thin Film Development Senior Engineer
- Process Integration Engineer
- Packaging System Engineer - Yoplait
- Summer 2026 Process Integration Intern (Bachelor/Masters - Santa Clara, CA)
- Packaging Substrate Engineer
- Senior Process Engineer - Thin Film Engineer
- Semiconductor Dry Etch Engineering Lead
- Semiconductor Dry Etch Engineering Lead
- Electrical Design & Verification Engineer (DVE), Leo Optical ISL Development
- Semiconductor Dry Etch Engineering Lead
- Director / VP of Manufacturing – Next-Generation Airborne Quantum Systems
- Test Design Engineer
- Packaging Development Engineer
- Validation Scientist