IC Packaging Engineer

IC Packaging Design EngineerLOC: Chandler, AZ or Hillsboro, OR (ONSITE)Longterm Contract – 1 YearBachelor’s or Master’s degree in Electrical /Electronics EngineeringExperience:Strong hands-on experience in Siemens (Mentor) Xpedition (XPD); Alternatively: Cadence Allegro/Advanced Package Designer (APD / SiP)Candidates should have experience in the below domains:Physical Design & LayoutSubstrate design and layoutSI/PI aware design implementationDesign for performance, manufacturability, yield, and reliabilityDesign rule compliance