Lead Engineer, Advanced Packaging & 3D Integration

Micron Technology, Inc in Boise is seeking a Principal Engineer to lead the APTD team in shaping next-generation semiconductor packaging technologies. This position is vital for influencing product quality and reliability. Ideal candidates will have 5+ years of experience in semiconductor advanced packaging and a relevant degree. The role involves collaboration, mentoring, and driving innovation in an exciting, fast-paced environment. Micron offers comprehensive benefits, supporting the well-being and future preparation of its employees. #J-18808-Ljbffr