Lead Engineer, Advanced Packaging & 3D Integration
ARCHIVED
We can't find an active application page for this role right now. It may reopen or be listed elsewhere. Use Next Steps to search for an active apply link and similar live jobs.
Micron Technology, Inc in Boise is seeking a Principal Engineer to lead the APTD team in shaping next-generation semiconductor packaging technologies. This position is vital for influencing product quality and reliability.
Ideal candidates will have 5+ years of experience in semiconductor advanced packaging and a relevant degree. The role involves collaboration, mentoring, and driving innovation in an exciting, fast-paced environment.
Micron offers comprehensive benefits, supporting the well-being and future preparation of its employees.
#J-18808-Ljbffr