IC Packaging Process Engineer

Silitronics takes pride in delivering Vertically Integrated Design and Assembly Services for next-generation products in AI/ML, Silicon Photonics, High Performance Computing, IoT Sensors, Medical, Defense, LiDAR, RF, and Commercial Applications. Our team brings over 100 years of combined domain expertise in Complex Assembly, Substrate and Board Design, Silicon Assembly, and automated Photonics Active Alignment. Silitronics specializes in advanced Semiconductor IC and Photonics PIC assembly, complemented by value-added design engineering services. We are seeking a motivated Manufacturing Process Engineer to support the development, optimization, qualification, and continuous improvement of semiconductor packaging and assembly processes. This is a hands-on engineering role supporting New Product Introduction (NPI), prototype builds, process characterization, qualification, production ramp, and ongoing manufacturing improvements. The ideal candidate will have 2+ years of hands-on engineering experience, a strong interest in semiconductor packaging and manufacturing, and the ability to work closely with Engineering, Operations, Quality, customers, suppliers, and equipment vendors. Responsibilities: * Support development, optimization, and qualification of semiconductor packaging and assembly processes * Support NPI activities from prototype and engineering builds through process qualification and production release * Work with processes including Flip Chip, Die Attach, Wire Bonding, SMT, BGA, Reflow, Underfill, and Encapsulation * Assist with DOE, process characterization, process window development, and process capability studies * Develop and maintain process documentation including process flows, work instructions, PFMEAs, control plans, and qualification reports * Support equipment, tooling, fixture, material, and process parameter development * Provide hands-on engineering support on the production floor and troubleshoot process and equipment issues * Investigate manufacturing issues, perform root-cause analysis, and implement corrective actions * Monitor process performance using SPC and statistical analysis to improve yield, quality, and process stability * Support continuous improvement activities focused on yield, cycle time, throughput, manufacturability, and cost * Collaborate with Engineering, Operations, Quality, Equipment Engineering, customers, suppliers, and other technical teams * Support introduction and qualification of new equipment, materials, tooling, and manufacturing technologies * Manage assigned engineering projects and communicate progress, issues, and results to cross-functional teams * Qualifications: * BS or MS in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Manufacturing Engineering, or a related engineering discipline * 2+ years of hands-on experience in semiconductor packaging, electronics assembly, semiconductor manufacturing, or process engineering * Understanding of semiconductor packaging and assembly processes * Hands-on experience with one or more of the following: Flip Chip, Copper Pillar, Fine-Pitch SMT, BGA, Die Attach, Wire Bonding, Thermocompression Bonding, Reflow, Underfill, X-Ray Inspection, AOI, or Cross-Section Analysis * Basic experience with DOE, SPC, process capability, and statistical analysis * Familiarity with PFMEA, Control Plans, root-cause analysis, and structured problem-solving * Strong analytical, troubleshooting, and problem-solving skills * Strong communication and teamwork skills with the ability to work across engineering and manufacturing teams * Ability and willingness to work hands-on with production equipment and manufacturing processes Preferred (Nice to Have): * Experience with advanced semiconductor packaging, photonics, RF, AI/ML, or High Performance Computing applications * Experience with heterogeneous integration, chiplets, advanced substrates, or hybrid bonding * Familiarity with IPC, JEDEC, or semiconductor packaging reliability standards * Experience working in an ISO-certified, ESD-controlled, or cleanroom manufacturing environment * Experience with SolidWorks, MATLAB, Python, or other engineering/data analysis tools * Experience with equipment or process qualification Soft Skills: * Hands-on and inquisitive mindset with a strong desire to learn and solve technical problems * Strong attention to detail and commitment to quality * Effective communication and ability to work collaboratively across multidisciplinary teams * Organized, responsive, and capable of managing multiple engineering priorities * Comfortable working in a fast-paced R&D and manufacturing environment Silitronics provides comprehensive health benefits including medical, vision, and dental coverage; company-paid holidays and sick leave; 401(k) with company match; paid vacation; short-term and long-term disability insurance; and company-sponsored events. Employees have the opportunity to work hands-on with advanced semiconductor packaging, IC assembly, photonics, and next-generation manufacturing technologies across AI/ML, Silicon Photonics, High Performance Computing, LiDAR, RF, Medical, Defense, and other advanced applications. This role provides opportunities to develop expertise in semiconductor packaging, manufacturing process engineering, NPI, and precision assembly while working in an innovative and collaborative engineering environment. Job Types: Full-time, Permanent Pay: $90,000.00 - $120,000.00 per year Benefits: * 401(k) * 401(k) matching * Dental insurance * Employee assistance program * Flexible spending account * Health insurance * Health savings account * Life insurance * Paid time off * Referral program * Retirement plan * Vision insurance Work Location: In person