Lead Advanced Packaging Plating Module Engineer

Intel Corporation in Hillsboro, Oregon is seeking an experienced Module Development Engineer to advance advanced packaging plating modules. You will develop and optimize plating processes, perform feasibility studies, and enable high-volume manufacturing for next-generation device architectures. The role emphasizes collaboration with equipment and material suppliers, data analytics, and SPC to ensure process stability and scalable production.#J-18808-Ljbffr