Sr Principal Process Development Engineer
Overview:
In this role you will own and optimize SMT processes for probe card PCB assembly, ensuring high-quality output and stable production. You'll lead cross-functional improvements across plating, lithography, mechanical assembly, and electrical test teams to enhance yield and process robustness. You will drive equipment performance, defect reduction, and continuous improvement initiatives. This position offers the opportunity to shape advanced SMT manufacturing for high-density probe cards in a global, customer-focused environment. Compensation / Benefitsmedical, dental, vision benefits 401(k) with company matchemployee stock purchase plan (ESPP)paid time offquarterly profit-sharing bonusesflexible spending accounts
Responsibilities:
- Develop, qualify, and maintain SMT processes including solder paste selection, injection, inspection, reflow profiling, and placement parameters
- Own recipe creation and optimization for high-density probe card PCBsImprove process capability (Cp/Cpk) and maintain stable production performance
- Provide daily engineering support for SMT equipment (stencil printer, pick-and-place, reflow oven, SPI)
- Lead troubleshooting and root cause analysis for equipment failures and defects
- Define and maintain PM schedules, calibration, and spare parts strategies
- Monitor yield, defects Pareto, and SPC trends; lead DfX discussions with design engineering
- Implement corrective actions and robust controls for solder bridging, opens, voiding, tombstoning, and wetting
- Support production with process deviations, equipment issues, and new product introductions
- Develop documentation (WI/SOPs, setup sheets, inspection criteria) and drive cycle time reduction and training
- Collaborate with plating, photolithography, mechanical/assembly, and electrical test teams
- Lead Lean/6s initiatives to reduce waste and improve process robustness
- Evaluate and introduce new materials and improved stencil/hardware designs
- Participate in equipment justification and capital project planning
- Provide engineering support during prototype builds and customer-specific configurations
Key requirements:
- Bachelor's degree in relevant engineering field3–7 years SMT or PCB assembly experience (semiconductor/PCBA/electronics assembly preferred)
- Strong understanding of solder paste behavior, reflow principles, and defect mechanisms
- Hands-on experience with SMT equipment and inspection systems (SPI, AOI)
- Proficiency with SPC, FMEA, DOE, and root cause problem solving
- Experience in probe card, semiconductor test hardware, or high-precision PCB manufacturing
- Familiarity with high-density BGAs, fine-pitch components, and micro-assembly
- Knowledge of CAM/EDA data for stencil/paste aperture optimization
- Lean/6s Green Belt or Black Belt certification
- Experience with MES systems and factory automation
- Strong ownership mindset
- Excellent troubleshooting and structured problem solving
- Ability to work cross-functionally in a fast-paced, high-mix environmentSMT equipment and inspection systems (SPI, AOI)
- Solder paste behavior and reflow principles
- Process capability (Cp/Cpk)