Training Technicians

Key ResponsibilitiesDeliver practical and theoretical training on IC manufacturing processes such as:Wafer handling and preparationDie attach, wire bonding, and flip-chip processesEncapsulation / molding techniquesTrimming, forming, and singulationElectrical testing, burn-in, and final testTrain students on semiconductor equipment operation, tool handling, and basic machine troubleshooting.Instruct trainees on cleanroom protocols, ESD control, contamination control, and safety practices.Demonstrate process flow from wafer to finished IC package and explain yield, defects, and failure modes.Conduct hands-on labs, simulations, and process demonstrations as per OSAT curriculum.Prepare trainees for OSAT / NSQF-aligned skill assessments through mock tests and skill evaluations.Ensure compliance with quality systems such as SPC, SOPs, and basic ISO practices relevant to IC manufacturing.Maintain training equipment, ESD stations, and consumables; ensure calibration and readiness.Track trainee performance, attendance, and competency development; maintain training documentation.Support internal and external assessors during OSAT certification assessments.Provide basic orientation on semiconductor industry expectations, shift culture, and shop-floor discipline.Coordinate with industry partners, assessment bodies, and placement teams when required.Required Qualifications* ITI / Diploma in Electronics, Electrical, Mechatronics, Instrumentation, or Semiconductor Technology.* OSAT / NSQF / Semiconductor Skill Certification preferred.Experience1-5 years of hands-on experience in IC manufacturing, semiconductor assembly & test, or electronics manufacturing.Experience in cleanroom or ESD-controlled environments is highly desirable.Training or mentoring experience is an added advantage.Technical SkillsKnowledge of semiconductor assembly and test processes.Understanding of IC packaging types (DIP, QFN, BGA, CSP, etc.).Familiarity with ESD standards, cleanroom protocols, and contamination control.Basic understanding of yield, defects, and failure analysis.Ability to read process flow diagrams, SOPs, and equipment manuals.Basic computer skills for reporting and documentation.Soft SkillsClear communication and demonstration skills.Strong discipline and safety-first mindset.Patience and ability to train entry-level candidates.Willingness to upgrade skills with evolving semiconductor technologies.Work Environment* Training labs simulating cleanroom and IC manufacturing environments.* May require extended hours during assessments or industry-aligned programs.Key Performance Indicators (KPIs)Trainee competency and OSAT assessment success rate.Compliance with cleanroom, ESD, and safety standards.Equipment uptime and lab readiness.Trainee feedback and placement readiness in semiconductor roles.Key ResponsibilitiesDeliver practical and theoretical training on IC manufacturing processes such as:Wafer handling and preparationDie attach, wire bonding, and flip-chip processesEncapsulation / molding techniquesTrimming, forming, and singulationElectrical testing, burn-in, and final testTrain students on semiconductor equipment operation, tool handling, and basic machine troubleshooting.Instruct trainees on cleanroom protocols, ESD control, contamination control, and safety practices.Demonstrate process flow from wafer to finished IC package and explain yield, defects, and failure modes.Conduct hands-on labs, simulations, and process demonstrations as per OSAT curriculum.Prepare trainees for OSAT / NSQF-aligned skill assessments through mock tests and skill evaluations.Ensure compliance with quality systems such as SPC, SOPs, and basic ISO practices relevant to IC manufacturing.Maintain training equipment, ESD stations, and consumables; ensure calibration and readiness.Track trainee performance, attendance, and competency development; maintain training documentation.Support internal and external assessors during OSAT certification assessments.Provide basic orientation on semiconductor industry expectations, shift culture, and shop-floor discipline.Coordinate with industry partners, assessment bodies, and placement teams when required.Required Qualifications* ITI / Diploma in Electronics, Electrical, Mechatronics, Instrumentation, or Semiconductor Technology.* OSAT / NSQF / Semiconductor Skill Certification preferred.Experience1-5 years of hands-on experience in IC manufacturing, semiconductor assembly & test, or electronics manufacturing.Experience in cleanroom or ESD-controlled environments is highly desirable.Training or mentoring experience is an added advantage.Technical SkillsKnowledge of semiconductor assembly and test processes.Understanding of IC packaging types (DIP, QFN, BGA, CSP, etc.).Familiarity with ESD standards, cleanroom protocols, and contamination control.Basic understanding of yield, defects, and failure analysis.Ability to read process flow diagrams, SOPs, and equipment manuals.Basic computer skills for reporting and documentation.Soft SkillsClear communication and demonstration skills.Strong discipline and safety-first mindset.Patience and ability to train entry-level candidates.Willingness to upgrade skills with evolving semiconductor technologies.Work Environment* Training labs simulating cleanroom and IC manufacturing environments.* May require extended hours during assessments or industry-aligned programs.Key Performance Indicators (KPIs)Trainee competency and OSAT assessment success rate.Compliance with cleanroom, ESD, and safety standards.Equipment uptime and lab readiness.Trainee feedback and placement readiness in semiconductor roles.Learn More about TATA ElectronicsGo to websiteLearn More About Tata ElectronicsApply now "Find similar jobs: