Electronics Packaging Engineer

Job Title: Electronics Packaging EngineerLocation: Wall Township, NJJob Type: Full-TimeSalary: $110K - $150K USD (depending on experience)Overview:We are seeking an Electronics Packaging Engineer to support the design and development of advanced electronic and semiconductor packaging solutions. This is a hands-on role requiring strong technical expertise, project ownership, and direct customer interaction. The ideal candidate brings a proactive, solution-oriented mindset, thrives in a small company environment, and has a proven ability to solve complex engineering challenges.Key Responsibilities:Design and develop electronic and semiconductor packaging solutions from concept through productionManage projects, timelines, and deliverables across cross-functional teamsWork directly with customers to understand requirements and deliver technical solutionsSupport PCB and substrate integration and overall system packaging designDevelop and improve assembly processes, including SMT and related manufacturing methodsEvaluate and select materials such as adhesives, underfills, encapsulants, and conductive materialsAddress thermal management challenges and ensure product reliabilitySupport miniaturization and advanced packaging initiativesTroubleshoot technical issues and perform root cause analysisDrive continuous improvement in product performance and manufacturing processesQualifications:Bachelor degree in Electrical Engineering, Materials Science, Mechanical Engineering, or related field5+ years of experience in electronics or semiconductor packagingStrong project management and organizational skillsExperience working directly with customers in a technical settingExcellent problem-solving skills and attention to detailAbility to work effectively in a small, fast-paced environmentMust be within commuting distance of Wall Township, NJPreferred Experience:Semiconductor or device packagingPCB and substrate integrationThermal management designInterconnects and assembly processesReliability testing and environmental performanceMaterials selection for electronic packaging applicationsSMT or process engineeringMiniaturization and heterogeneous integrationAdvanced packaging technologies such as 2.5D, 3D, chiplets, or flexible or hybrid electronicsBenefitsCompetitive SalaryHealth InsuranceDental InsuranceVision InsurancePaid Time OffPaid HolidaysCareer Growth & Leadership Opportunities!