Process Integration/Device Technology Development Engineer

Process Integration/Device Technology Development Engineer defines, develops and implements silicon process technology for the manufacture of integrated silicon devices. The successful candidate will be responsible for unit/process module development, process flow implementation, design rule definition, device architecture, electrical characterization and technology qualification. These tasks will be associated with new silicon technology developments and transfers of existing silicon technologies in and out of the resident fab. Work experience related to BCD, Discretes and hybrid SMART Power technologies preferred. onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. More details about our company benefits can be found here: https://www.onsemi.com/careers/career-benefits We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work. onsemi is an Equal Opportunity and Affirmative Action employer. The Company maintains policies and practices that are designed to prevent discrimination or harassment against any qualified applicant or employee to the extent prohibited by federal, state and local laws and regulations. By way of example, discrimination on the basis of race (actual or perceived), ethnicity, color, religion, ancestry, national origin, citizenship, sex, age, marital status, sexual orientation, physical or mental disability, medical condition, genetic information, military or veteran status, gender identity, gender expression, or any other characteristic protected by applicable law is prohibited. If you are an individual with a disability and require a reasonable accommodation to complete any part of the application process, or are limited in the ability or unable to access or use this online application process and need an alternative method for applying, you may contact Talent.acquisition@onsemi.com for assistance. MS or PhD in Electrical Engineering, Physics, Chemistry, Chemical Engineering, Materials Engineering or related technical field. Solid understanding of semiconductor device physics including CMOS, DMOS, Bipolar and Trench FET devices. Background in semiconductor process technology and wafer fabrication. Knowledge of one or more of the following engineering disciplines: Process Integration, Design, Modeling, and/or Process Engineering. Hands on knowledge of process and device TCAD simulations. Ability to utilize DOE and statistical analysis. Excellent written and oral communication skills. Must be an effective team player. Proven problem solving ability. Preferred: Foreign language skills - (Japanese is the most desirable; Dutch, French, Korean, or Czech are also useful). Willing to relocate to another internal fab/site after training. Prefer experience with 180 nm through 40nm technologies. Experience with design and evaluation of physical and electrical design rule test structures. Knowledge of one or more of the following technologies: Bipolars, CMOS, High Voltage DMOS, Vertical FETs, Silicon on Insulator (SOI), CMOS Image Sensors (CIS), EEPROM, Non-Volatile Memory (NVM), Dual Damascene copper integration. Knowledge of one or more Wafer Level Reliability (WLR) and Intrinsic Reliability testing methodology, such as gate oxide integrity (GOI), VRamp, time dependent dielectric breakdown (TDDB), hot carrier injection (HCI), electromigration (EM), stress migration (SM). Develop unit process and process modules for CMOS, Discretes and hybrid Smart Power technologies. Process module characterization for robustness and manufacturability. Create technology process flows with process specifications. Design test structures for process integration and process module development. Design statistical experiments and analyze results to optimize device architecture and/or process modules. Define device architecture, technology design rules and electrical target specifications. Process and Device TCAD to achieve device targets and reliability requirements. Translate product circuit performance requirements to semiconductor device requirements. Drive process and device optimization to meet technology requirements. Facilitate process improvements and/or fixes for problems of poor reliability or low yield. Support Process Engineering and Yield Engineering groups to improve process quality and yield of technologies released to manufacturing.