Signal Integrity & Interconnect Engineer — High Speed Channels & mmWave Packaging

OverviewDesign and optimize the high‑speed interconnect “highways” that enable Point2’s next‑generation ultra‑high‑speed data‑center links. Work across die, package, PCB, and complex mechanical connectors to ensure flawless signal transmission at mmWave and sub‑THz frequencies. Join a fast‑paced, highly technical team where your SI expertise directly shapes system performance and product success.ResponsibilitiesDesign and model high‑speed interconnects from silicon die through package, PCB, and external connectors.Define system architecture for near-package and co-package e-Tube for datacenter rack backplaneUse advanced 3D EM simulation tools (e.g., HFSS) to model vias, transitions, connectors, and complex channel structures.Optimize channel performance for mmWave and sub‑THz operation, including parasitics, coupling, and EM behavior.Perform post‑fabrication lab validation using VNAs, TDRs, high‑speed oscilloscopes, and BERTs.Correlate simulation results with measured data and refine models for accuracy and performance.Collaborate closely with RFIC designers, mechanical engineers, and system architects on co‑design and integration.Contribute to design reviews, architecture discussions, and system‑level SI strategy.QualificationsPh.D. in Electrical Engineering, Physics, or related field, or M.S. with 3+ years of relevant industry experience.Extensive hands‑on experience with 3D EM simulation for SI/PI modeling of PCB interconnects, vias, and connectors.Experience with data center AI cluster scale-up architecture, system configuration, connectivity technologies, and SI modelsStandards knowledge with Ethernet, PCIe, NVLink, UALink, IEEE 802.3xxStrong background in high‑frequency lab measurements and model‑to‑hardware correlation.Excellent problem‑solving, communication, and cross‑functional collaboration skills.Location(s)Silicon Valley, CA (San Jose metro area)Irvine, CA (Orange County area)