Staff Manufacturing Engineer, Advanced Components

Overview In this role you will lead the development and qualification of new supply chain and technology platforms for advanced component applications. You will work in cross‑functional teams to ensure quality, reliability, volume, delivery and cost objectives. You’ll drive testing, validation and supplier collaboration in a highly automated manufacturing environment. This is a high‑impact position shaping supplier interfaces and stage‑gate processes for next‑gen implantable devices. ResponsibilitiesDefine and deploy technology platforms for new product applications with testing, simulation, and prototypingQualify surface mount components for manufacturing useApply systematic problem‑solving to resolve quality/performance issues with suppliers and teamsLead testing and validation of components for high reliability using use case based testsLead stage-gate approvals, documentation, and sustaining support in an automated factorySupport new development projects ensuring compliance to internal and industry standardsPerform failure analysis and drive to root cause with production and prototypingEngage with internal and external customers on technical topicsAssess and communicate with stakeholders to qualify supplier process changesConduct on-site supplier audits, domestically and internationally Key requirements8+ years experience with chip scale packaging, direct bump attach, copper pillar, and similar technologiesDetailed knowledge of wafer-level packaging, wire bond, encapsulation, and chip attach; materials and processesKnowledge of IC packaging failure modes and root cause analysisExperience in high reliability electronics manufacturingExperience with quality systems and documenting quality-relevant informationStrong physics-based reasoningFailure analysis and root cause corrective action with suppliersProven ability to lead engineering projects and experiments to scheduleLeadership skills to coach and lead technical staffProficiency with Excel, Word, PowerPointAbility to interface across Quality, Manufacturing, Supply Chain, Test, and Developmentexcellent written and verbal communicationdetail-orientedleadership and mentoringchip scale packagingdirect bump attachcopper pillar