Semiconductor Hermetic Packaging Process Engineer

Basic QualificationsEducation: Bachelor’s degree in Electrical, Materials, Mechanical Engineering or Similar disciplineMinimum 2 Years of Experience related to Manufacturing Engineering Disciplines (Product/Process/Operations/Quality)Experience in Mechanical Precision Alignment and/or Wire bondingFamiliarity with Microsoft Office Suite of Products (Word, Excel, PowerPoint)Excellent written/oral communication, strong problem‑solving/root‑cause analysis, cross‑functional collaboration.Ability to obtain and maintain a Secret Security Clearance, which requires U.S. citizenship.Job DescriptionYou will be the Semiconductor Hermetic Packaging Process Engineer for the Semiconductor Packaging Team. Our team is responsible for advancing hermetic packaging solutions for infrared sensor modules.What You Will Be DoingAs the Semiconductor Hermetic Packaging Process Engineer you will be responsible for developing, qualifying, and sustaining dewar process modules that enable high‑yield production of IR sensors.Your Responsibilities Will Include, But Are Not Limited ToDefine, develop, and transfer hermetic‑packaging processes for IR sensor modules.Own equipment lifecycle, including capital identification, qualification, validation, and preventive maintenance.Write and maintain process work instructions, operational instructions, and inspection plans.Conduct statistical process control, capability assessments, and continuous monitoring.Lead risk assessments, PFMEA, and corrective‑action investigations to ensure reliability.Why Join UsWe seek a collaborative engineer who thrives on solving complex technical challenges and driving continuous improvement. This role offers the chance to shape cutting‑edge packaging technology, work with cross‑functional teams, and make a tangible impact on mission‑critical sensor performance.We are committed to supporting your work‑life balance and overall well‑being, offering flexible scheduling options. Learn more about Lockheed Martin’s comprehensive benefits package here.Further Information About This OpportunityThis position is in Santa Barbara. Discover more about our Santa Barbara, California location.MUST BE A U.S. CITIZEN - This position is located at a facility that requires special access. The selected candidate must be able to obtain a Secret clearance.Desired SkillsExperience in Laser Welding, Vacuum Processing, Painting, Machining, 3D Printing, Mechanical Design (CREO) Experience, Automated System Programming (G-Code, LabVIEW, MatLAB, Other)Experience working in clean room environment with ESD protection protocols.Green / Black Belt LSS Certification (DOE, SPC, JMP, Data Scripting)Familiarity with ERP/CDM Systems (SAP, Windchill preferred)Familiarity with Project Planning Tools (IMS, Gantt Charts, BOEs)Other Important InformationBy applying to this job, you are expressing interest in this position and could be considered for other career opportunities where similar skills and requirements have been identified as a match. Should this match be identified you may be contacted for this and future openings.Ability to work remotelyOnsite Full-time: The work associated with this position will be performed onsite at a designated Lockheed Martin facility.