Senior Process Engineer

SENIOR PROCESS ENGINEERMesh Optical Technologies was founded on the belief that optical photons will be at the center of advanced technologies in the coming century. Making advanced technology ubiquitous means building at scale, and that's exactly what we're doing at Mesh.Our products require semiconductor-grade packaging processes—bumping, dicing, precision bonding, optical alignment, and automated assembly—executed at yield levels and volumes that demand real process engineering discipline. We are seeking a Senior Process Engineer to own the development and qualification of these processes from R&D through production ramp, and to help build high-volume semiconductor packaging process engineering in the US.RESPONSIBILITIESOwn development of wafer prep and die-level packaging processes: bumping, dicing, sub-micron precision bonding, sub-micron optical alignment, flip-chip die bonding, wire-bonding, dispense, fully-automated final assembly and associated materialsOwn tool selection, materials selection, recipe development, and statistical process control limits to transfer processes from R&D to volume productionTranslate package and product designs into high volume production processes and collaborate with electrical, mechanical, and photonic circuit design teams to design-for-manufacturingDesign production processes from the lab bench through proof of concept and production rampEstablish process limits and feedback process constraints as design rules to design teamsCharacterize parts with x-ray, FIB cut/SEM, CSAM, and die shear testing, closing the loop with electrical, mechanical, and photonic circuit design teamsAct as the technical owner for failure-analysis findings, root cause analysis, and corrective actionsPush process yields above 99.9% and thermal-cycle reliability for years-long qualificationProvide technical mentorship as we work to build up high-volume semiconductor packaging process engineering in the USQUALIFICATIONSMS or PhD in Materials Science, Chemical Engineering, Electrical Engineering, or similarExtensive (MS + 2 years) hands-on semiconductor process-development experienceStrong troubleshooting skills and hands-on experience in semiconductor packaging, assembly, or advanced manufacturing environmentsDemonstrated success qualifying processes such as flip-chip bonding, wafer processing, plasma cleaning, and wire bondingExpertise in statistical quality control and process improvement methodologies, with experience leading internal audits and driving continuous improvementComfortable working in a cleanroom or controlled manufacturing environment with cross-functional engineering teamsWillingness to work extended hours and weekends as neededPREFERRED EXPERIENCE5+ years of fab or wafer level packaging experience (e.g. lithography, etch, CVD, CMP, solder bumping, wafer dicing)Experience integrating photonic devices into complex opto-electronic packages, sub-µm die-bonding, wafer prep, and materials used in advanced packagingCOMPENSATION AND BENEFITS:Pay range:Senior Process Engineer: $140,000.00 - $180,000.00/per yearTitle and base salary are determined on a case by case basis commensurate with experience and merit.In addition to base salary, compensation for this role includes:Eligibility for long-term incentives including company stock options and discretionary bonuses awarded for exceptional achievements.Comprehensive medical, vision, and dental insurance with significant cost covered by the company for yourself and dependents.Paid parental leave and flexible PTO (3 weeks accrued vacation and 10 company holidays per year).401(k) retirement plan access.Relocation assistance to sunny Los Angeles.