Senior IC Package Layout Engineer - High-Speed GPU Hardware

A leading technology firm is seeking a Senior Package Layout Engineer to design and develop detailed layouts of IC substrates. The role involves collaboration with technical teams to enhance design productivity and resolve technical issues. Qualifications include a B.S. in Electrical Engineering and 5+ years in PCB Layout. Strong skills in Cadence APD are essential. The position offers a competitive salary range of $136,000 - $258,750 based on level and experience. #J-18808-Ljbffr