Failure Analysis (F/A) Engineer

About SheetakSheetak is a pioneer in solid-state thermoelectric technology, delivering precision thermal management solutions across industries including medical devices, aerospace, defense, data center cooling, and industrial electronics. As we continue to scale our thermoelectric device manufacturing and qualification capabilities, we are seeking a skilled Failure Analysis Engineer to join our leading-edge engineering team in Austin, Texas.Position SummarySheetak, Inc. is currently seeking a skilled Failure Analysis Engineer to join our leading-edge thermoelectric engineering team in Austin, Texas. The Failure Analysis Engineer will be responsible for FIB/SEM cross section and other physical analysis with technical expertise and leadership to address complex engineering challenges.Responsibilities / SkillsConduct X-sectioning, polishing, grinding, and lapping of metallographic samples to highlight microstructural features.Electrical probing combined with physical characterization methods like optical inspection (Keyence) and SEM to identify root cause of failures.Perform FIB cross-sectioning, SEM imaging, and EDS analysis on thermoelectric thin-film devices and process monitor samples.Lead failure investigation workflows: define hypotheses, select appropriate analytical techniques, and drive root cause identification.Correlate physical/structural findings with electrical characterization data (IV, resistance, impedance) to close the loop on device failures.Document analysis results in clear technical reports with actionable process feedback.Interface directly with process engineering and device teams to translate findings into yield improvement actions.Coordinate and schedule access to university-hosted analytical facilities (FIB/SEM, AFM, etc.), manage sample logistics, and ensure efficient utilization of allocated tool time.Serve as primary liaison with university nanofabrication/characterization facility staff to maintain access agreements and resolve scheduling or sample preparation issues.QualificationsRequiredBS in Mechanical Engineering, Electrical Engineering, or a similar field.3+ years of semiconductor-related failure analysis work using FIB/SEM tools.Data-driven mindset with strong attention to detail.Excellent verbal communication and technical writing skills.Thrives in a fast-paced environment with occasional weekend work.PreferredMS in Mechanical Engineering, Electrical Engineering, or a related field.Experience with other microscopy tools such as AFM, EDS, or EBSD.BenefitsMedical, Vision, and Dental Insurance.401(k) retirement plan.Paid Time Off (PTO).