Quality Engineer

Location: Colorado Springs (Onsite)Our TeamSemtech Corporation (NASDAQ:SMTC; www.semtech.com) is a leading supplier of high-quality analog and mixed-signal semiconductor products. Semtech is an organization headquartered in Camarillo, California with 31 offices in 14 countries around the world.Semtech’s Protection Business Unit is a group of passionate and talented individuals tasked to support the development of industry-leading protection integrated circuits (IC) for high performance analog and mixed-signal semiconductor for high-end consumer, automotive and industrial end market applications, dedicated to providing customers with high quality proprietary solutions and breakthrough technology.Job SummaryWe are seeking an experienced Quality Engineer with chip-scale packaging (CSP) and semiconductor backend assembly expertise to support our wafer-level and flip chip manufacturing operations. This role combines hands-on quality engineering with supplier quality management, focusing on process qualification, device characterization, corrective action leadership, and new product introduction (NPI). The ideal candidate brings deep technical knowledge of semiconductor packaging processes, proven ability to drive quality improvements through data-driven problem-solving, and skill in building collaborative relationships across engineering, manufacturing, and supplier organizations. This is a permanent, full-time position offering the opportunity to directly impact product quality and manufacturing excellence in a high-reliability semiconductor environment.ResponsibilitiesChip-Scale Packaging & Process QualitySupport qualification and validation of chip-scale packaging processes including flip chip, wafer-level CSP, die attach, molding, and plating operationsConduct statistically rigorous device characterization across process, voltage, and temperature (PVT) conditions to verify performance margins and detect reliability risksDesign and execute Design of Experiments (DOE) to optimize packaging process parameters, identify critical factors, and improve process robustnessApply Statistical Process Control (SPC) methodologies to monitor critical process parameters and process capability (Cpk/Ppk) for packaging operationsPerform Measurement System Analysis (MSA) and Gage R&R studies to validate inspection and test equipment capabilitySupport new product introduction (NPI) through process validation (IQ/OQ/PQ), first article inspection (FAI), and production readiness activitiesDevelop and maintain Process FMEAs (pFMEA), Control Plans, and process documentation for packaging operationsInvestigate and resolve quality issues related to packaging processes including solder joint integrity, die cracking, underfill defects, warpage, and assembly yieldCorrective Action & Problem Solving Lead corrective action reports CARs) using 8D methodology and structured root cause analysis (5-Why, fishbone, fault tree analysis)Partner with engineering and manufacturing teams to close open CARs through collaborative problem-solving, ensuring root causes are properly addressed and corrective actions are effectiveFacilitate cross-functional failure analysis and multi-factor experiments to identify process sensitivities and root causesTrack CAR closure progress and provide status reporting to Quality Director and site leadershipVerify effectiveness of implemented corrective actions through data analysis and follow-up validationSupport continuous improvement initiatives using Lean/Six Sigma methodologies and DMAIC problem-solvingSupplier Quality ManagementManage supplier non-conformances (SCARs), corrective actions, and performance improvement initiativesCoordinate with suppliers on process change notifications (PCNs), engineering changes, and qualification requirementsSupport supplier business reviews monitoring SPC data, yield trends, and reliability metricsQuality Systems & StandardsSupport maintenance of ISO 9001 quality management system and transition to IATF 16949 automotive standardsParticipate in internal audits and external certification activities as technical subject matter expertReview and approve quality documentation including procedures, work instructions, and process specificationsEnsure compliance with customer-specific quality requirements and aerospace/automotive industry standardsMinimum QualificationsBachelor's degree in Engineering, Materials Science, Physics, or related technical field5+ years of quality engineering experience in semiconductor backend assembly or microelectronics packagingDirect hands-on experience with chip-scale packaging technologies including flip chip, wafer-level CSP, or advanced packaging processesDemonstrated expertise in 8D methodology, root cause analysis (5-Why, fishbone, fault tree), and structured problem-solvingStrong statistical analysis skills including SPC, process capability (Cpk/Ppk), hypothesis testing, and Design of Experiments (DOE)Working knowledge of AIAG Core Tools: PFMEA, Control Plans, MSA, PPAP, and APQPExperience with ISO 9001 or equivalent quality management systemsProficiency with statistical analysis software (Minitab, JMP, or equivalent) and Microsoft Office suiteExcellent written and verbal communication skills with ability to influence across organizational levelsProven track record of building collaborative relationships with engineering, manufacturing, and supplier organizationsDesired QualificationsMaster's degree in Materials Science, Engineering, or related technical fieldSix Sigma Green Belt or Black Belt certificationCertified Quality Engineer (CQE) or Certified Quality Auditor (CQA) from ASQISO 9001 or IATF 16949 Lead Auditor certificationExperience with wafer fabrication processes (etch, PVD, lithography, thin films) to support packaging integrationDirect experience with flip chip bumping, redistribution layer (RDL) processes, or advanced wafer-level packagingSupplier quality experience with OSATs (Outsourced Semiconductor Assembly and Test) or foundriesFamiliarity with automotive (IATF 16949), aerospace (AS9100), or medical device (ISO 13485) quality standardsExperience with reliability testing including temperature cycling, HAST, HTOL, and failure analysis techniquesKnowledge of semiconductor metrology and characterization techniques (SEM, X-ray, C-SAM, profilometry)Advanced DOE expertise including fractional factorial, response surface methodology, and Taguchi methodsExperience with MES systems and quality data management platformsThe intent of this job description is to describe the major duties and responsibilities performed by incumbents of this job. Incumbents may be required to perform job-related tasks other than those specifically included in this description.All duties and responsibilities are essential job functions and requirements and are subject to possible modification to reasonably accommodate individuals with disabilities.We are proud to be an EEO employer M/F/D/V. We maintain a drug-free workplace.A reasonable estimate of the pay range for this position is $ 75,000 to $107,000 USD. There are several factors taken into consideration in determining base salary, including but not limited to: job-related qualifications, skills, education and experience, as well as job location and the value of other elements of an employee’s total compensation package.