Advanced Microelectronics Packaging Engineer

SAIC is seeking an Advanced Packaging Engineer to support missile system hardware design and analysis. You will collaborate with multidisciplinary engineering teams to develop, analyze, and validate advanced microelectronics packaging solutions for complex defense systems. Responsibilities include mechanical design/analysis, FEA/ MATLAB modeling, systems engineering throughout the lifecycle, and participation in SRR, PDR, CDR, and PRR reviews. #J-18808-Ljbffr