Senior IC Packaging Engineering Manager

Intel is seeking an experienced IC Packaging Design Manager in Phoenix, Arizona to lead advanced packaging solutions within the Advanced Design and Customer Engineering organization. You will manage a team of engineers, oversee project execution, and ensure compliance with industry standards. This role requires strong leadership in IC packaging design and collaboration across multiple teams. Ideal candidates will have over 9 years of relevant experience and significant technical expertise. #J-18808-Ljbffr