Packaging Module Development Engineer

Packaging Module Development EngineerLocation: Phoenix, ArizonaWorking Pattern: Full-Time | On-SiteSalary: $148,000–$209,000 + Bonus & Comprehensive BenefitsAre you passionate about advancing the future of semiconductor technology?We're looking for a Packaging Module Development Engineer to join a cutting-edge engineering team developing next-generation semiconductor packaging solutions. This is an exciting opportunity to work on innovative technologies that power AI, cloud computing and the future of high-performance electronics.You'll collaborate with world-class engineers to develop advanced thermo-mechanical simulation models, improve package reliability and influence the design of next-generation semiconductor products.What you'll be doing:Develop and validate finite element analysis (FEA) models for advanced semiconductor packagingPerform thermal and mechanical simulations to assess reliability, stress, warpage and package performancePartner with cross-functional engineering teams to optimise product and process designSupport experimental testing, material characterisation and failure analysisContribute to advanced modelling, simulation and AI-driven engineering initiativesDrive innovation across advanced packaging technologies and manufacturing processesWhat we're looking for:PhD in Mechanical Engineering, Materials Science, Chemical Engineering or a related discipline3+ years' experience in thermo-mechanical modelling and Finite Element Analysis (FEA)Experience with material characterisation techniques and silicon reliabilityStrong analytical and problem-solving skillsExperience within semiconductor packaging or semiconductor manufacturing is highly desirableKnowledge of Python, MATLAB or similar scripting tools is advantageousWhat's on offer?Competitive salary of $148,000–$209,000Performance bonus and stock opportunitiesComprehensive medical, retirement and wellbeing benefitsWork on industry-leading semiconductor technologiesCareer development within a global engineering organisationCollaborative, innovative and research-driven environmentIf you're ready to help shape the future of semiconductor packaging and work on technology that powers tomorrow's innovations, we'd love to hear from you.Apply today.