Failure Analysis Engineer

Position: PHYSICAL FAILURE ANALYSIS ENGINEER - Bilingual in KoreanLocation: COVINGTON, GA JOB SUMMARYResponsible for performing physical failure analysis of glass substrates. This includes using a variety of techniques, such as microscopy, spectroscopy, and metallurgy to identify the root cause of failures. The ideal candidate will have a strong background in electrical engineering and be able to work independently and as part of a team. DUTIES/RESPONSIBILITIES:Investigate physical failures and defects including delamination, cracks, and voids using advanced microscopy and analytical techniquesPrepare samples for analysis, including cutting, polishing, and coating, while ensuring preservation of relevant featuresUse optical microscopes, electron microscopes, and other imaging tools to examine samples at various scalesAnalyze images to identify defects, fractures, corrosion, and other anomaliesAnalyze data collected from various analyses to develop comprehensive understanding of failure mechanismsGenerate detailed reports outlining findings, analysis methodologies, and recommendationsUtilize spectroscopic methods to identify material compositions and elemental distributionsPerform mechanical and thermal testingPrepare reports and documentation of failure analysis resultsWork with other engineers and scientists to develop and improve the failure analysis processParticipate in quality control procedures, including instrument calibration and performance checkTroubleshoot technical issuesProvide support to the OQA function with analysis results  REQUIREMENTS:Experiences on SEM / FIB equipments (Analysis tools)Proficiency in operating microscopy equipment (optical, SEM, FIB, TEM) and analytical tools (FTIR, EDX)Excellent analytical and problem-solving skills to identify root cause of failuresStrong attention to detail and ability to accurately document findings and observationsExcellent communication skills and a proven ability to juggle multiple high priority tasks QUALITIFICATIONS:Strong knowledge of electronic devices and their failure mechanismsExperience with a variety of failure analysis techniquesProficiency in microscopy techniques, material analysis, and spectropyStrong understanding of material properties, fracture mechanics, and root cause analysisProficiency in operating microscopy equipment (optical, SEM, TEM) and analytical tools (FTIR, EDX) EDUCATION:Bachelor’s degree in material science, electrical engineering, or related field EXPERIENCE:3+ years of experience in physical failure analysis in electronic or semiconductor applicationsExperience in a Manufacturing Environment SALARY:$85,000 - $115,000