Microelectronics Packaging Engineer SWaP Prototyping
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Phase2 Technology in Beavercreek, Ohio is seeking a Microelectronics Advanced Packaging Engineer to design and analyze systems in dynamic and R&D environments. The role requires experience with advanced packaging technology and eCAD/mCAD software, alongside the ability to develop solutions optimizing Size Weight and Power (SWaP). A Bachelor's degree in engineering and the ability to obtain a Secret clearance are essential. The compensation range is $61,900 to $141,000 annually.
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