Plasma Etch Process Development Engineer - Advanced Packaging

Intel Corporation is seeking an experienced Plasma Etch Process Development Engineer in Hillsboro, Oregon. The role focuses on optimizing dry etch processes for next-generation semiconductor packaging technologies. Candidates should possess a Master's or PhD in relevant engineering fields and experience in semiconductor manufacturing processes. Key responsibilities include developing and optimizing plasma etch processes, collaborating with cross-functional teams, and guiding technology roadmaps to meet future manufacturing needs. This position offers competitive compensation and excellent benefits. #J-18808-Ljbffr