Electrical Test & ATE Engineer

Open roleElectrical Test & ATE EngineerWhy this work mattersTouchdown is engineering the manufacturing behind storage, memory systems, and other chips. This role helps turn a buyer's physical result into a qualified process or a defensible decision to use an existing supplier. Advanced packaging is our intended first fab class; no production fab is operating today.OverviewYou will translate product requirements into electrical tests that can reject a bad part and explain why. Define probe or package-test interfaces, fixtures, limits, calibration, binning, data capture, and correlation to system use. Compare existing test capacity before proposing owned equipment. A passing test is meaningful only when coverage, measurement uncertainty, and escape risk are explicit.What you will ownDefine known-good-die evidence, package/interconnect test, fixtures, coverage, and accept/reject decisions.Define incoming known-good-die evidence and final package electrical acceptance.Design fixtures, test programs, limits, coverage, calibration, and correlation across sites.Link failing pins, nets, power, timing, and thermal conditions to physical failure analysis.Build tests that distinguish product defects from fixture, contact, instrument, or software failures.Review guard bands and sampling with product, quality, and reliability owners before a release limit is changed.Technical territoryWafer, die, package, and system-level test where relevant; ATE programs, fixtures and load boards, parametric limits, timing and power measurements, test coverage, binning, correlation, calibration, yield, and failure-analysis handoff.Representative outputsA test-coverage and correlation plan tied to customer CTQs and downstream failure modes.A test specification with vectors, limits, guard bands, coverage, and disposition rules.A correlation study between incoming die, post-assembly, and reliability test.A test-program revision and correlation packet covering fixtures, calibration, limits, bins, coverage gaps, false rejects, and escape risk.What success looks likeGood units pass consistently while meaningful defects are caught.Customer and quality teams can trace each accept/reject decision to test evidence.Accepted parts pass a repeatable test linked to the customer's use condition and reject authority.Yield changes can be separated into product movement, test drift, and handling or contact issues.What you bringWafer or package test, ATE, signal integrity, test correlation, and product debug.Built or qualified wafer, die, board, or package ATE programs.Can debug fixtures, signal integrity, contact resistance, and false rejects.Can connect test coverage to product use conditions and downstream escape risk.Experience developing, validating, or sustaining electrical test programs and hardware interfaces.Ability to interpret test distributions, debug test escapes, and communicate limits to product and quality teams.Helpful experienceHigh-speed or power-device testDFT, boundary scan, or test-program portabilityHigh-speed and power-device testDFT and fault coveragePackage-to-system correlationHow the role worksApplications are open; the exact work location, arrangement, compensation, and start date will be discussed during hiring.Early work can produce engineering plans and partner comparisons. Hands-on work begins only at qualified, authorized facilities.You will work with process, equipment, quality, test, customer, and supplier owners as the scope requires.Apply for this role →Show a real process, tool, workpiece, or product decision you owned, the measurements behind it, and what another team could reproduce.