Process

Backend Process Engineer – InP Wafer FabLocation: Alhambra, CAThe Backend Process Engineer – InP Wafer Fab position is responsible for development, optimization, and manufacturing support of backend wafer fabrication processes for Indium Phosphide (InP)–based photonic devices, including DFB lasers, Semiconductor Optical Amplifiers (SOAs), and Gain Chip products. This role provides technical ownership of critical backend modules including wafer lapping/thinning, n-side metallization, rapid thermal annealing (RTA), and automated optical inspection (AOI). The position also supports singulation, optical coatings, reliability readiness, and packaging interfaces, with a strong focus on yield, defect reduction, and manufacturing stability.ResponsibilitiesBackend Process Ownership and Optimization (35%):Own and optimize backend wafer fab processes including lapping/thinning, n-side metallization, and RTAEstablish robust process windows, recipes, and control limits for backend modulesMaintain stable manufacturing performance through continuous monitoring and improvementYield Improvement, Defect Reduction, and AOI Control (25%):Own and maintain AOI processes for backend defect detection and yield monitoringDrive singulation yield improvement and defect reduction through data analysis and root-cause investigationsAnalyze inline and post-process data to identify trends and systematic issuesImplement corrective and preventive actions and verify effectivenessSingulation, Optical Coatings, and Packaging Interface Support (20%):Support cleaving, dicing, and singulation processes to ensure device integrityProvide process engineering support for AR/HR optical coatings and vendor qualificationsCollaborate with packaging, device, and reliability teams to ensure packaging readinessNew Product Introduction and Technology Support (10%):Support new product introduction (NPI), process transfers, and technology changesEvaluate backend process risks associated with new designs, materials, and device structuresDocumentation, Process Control, and Manufacturing Support (10%):Author and maintain SOPs, travelers, process specifications, and control plansDefine SPC metrics and control strategies for backend processesProvide hands-on manufacturing and troubleshooting support as neededMinimum Qualifications:Bachelor's degree or higher in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or a related fieldMinimum of 3+ years of experience in backend semiconductor processingHands-on experience with lapping/thinning, metallization, and thermal processesUnderstanding of InP-based or III-V compound semiconductor wafer fabrication processesExperience with AOI systems, yield analysis, and data-driven process improvementStrong understanding of singulation, packaging interfaces, and reliability requirementsProficiency in SPC, DOE, and statistical analysisAbility to work across cross-functional manufacturing and engineering teamsPreferred experience with InP or III-V optoelectronic devicesFamiliarity with AR/HR optical coating processesExperience supporting high-mix, low-volume manufacturing environments preferredThe intent of this job description is to describe the major duties and responsibilities performed by incumbents of this job. Incumbents may be required to perform job-related tasks other than those specifically included in this description.All duties and responsibilities are essential job functions and requirements and are subject to possible modification to reasonably accommodate individuals with disabilities.A reasonable estimate of the pay range for this position is $100,000 - $135,000. There are several factors taken into consideration in determining base salary, including but not limited to: job-related qualifications, skills, education and experience, as well as job location and the value of other elements of an employee's total compensation package.