Lead Architect, Physics AI for 3D-IC Thermal Reliability

A leading technology firm is seeking a visionary technical leader to head their new division focused on 3D-IC Thermal-Mechanical Reliability. This role will involve owning the technical roadmap and leading innovative simulation workflows to address critical challenges in the semiconductor industry. The ideal candidate will possess a PhD in Mechanical Engineering or a related field, with over 10 years of industry experience in 3D-IC reliability. Competitive compensation and benefits are offered at this fast-growing startup. #J-18808-Ljbffr