计算电磁算法工程师（FEM)-Computational Electromagnetics (CEM) Algorithm Engineer – DC & Thermal
Role SummaryWe are seeking a technically rigorous and customer-focused Product Manager to lead the development of our thermal stress simulation module for advanced semiconductor packaging. This role sits at the intersection of semiconductor technology, multiphysics simulation, and product strategy. You will shape the product roadmap, define functional requirements, and work closely with R&D, algorithm, and UX teams to deliver differentiated simulation solutions that address critical thermal-mechanical challenges in 2.5D/3D-IC and chiplet-based designs.Job Responsibilities:1. Continuously monitor the market and demand for thermal stress simulation in advanced semiconductor packaging (2.5D/3D-IC, chiplets), conduct in-depth analysis of competitor activities and market movements, and develop product differentiation strategies.2. Engage in in-depth communication with chip design companies, foundries, OSATs, and system manufacturers to identify thermal stress pain points (e.g., chip warpage, TSV stress/delamination, μbump fatigue, underfill cracking, thermal cycle life), and translate vague requirements into actionable functional specifications.3. Develop a product roadmap for the thermal stress simulation module based on customer use cases, industry technology trends, and thermal-mechanical coupling simulation requirements.4. Draft the Product Requirements Document (PRD), defining solver functionality, material models, pre- and post-processing interfaces, and integration methods with EDA design platforms.5. Serve as a bridge between the algorithm, software engineering, and UX teams to drive feature implementation.Qualifications:1. Master’s degree or higher in Mechanics, Materials Science, Microelectronics, Mechanical Engineering, Physics, or a related field.2. Familiarity with 3DIC/advanced packaging structures (e.g., TSV, SiP, Chiplet) and processes (e.g., bonding, reflow, injection molding, temperature control profiles), as well as thermal stress failure mechanisms.3. Proficient in at least one mainstream thermal stress simulation tool (e.g., ANSYS, Ansys Mechanical, Celsius, 3DStress, COMSOL), with an understanding of its technical principles and limitations.4. At least 3 years of experience in semiconductor packaging thermal stress simulation projects, capable of independently completing geometric modeling, simulation setup, result analysis, and validation/correlation.Notes:1. Work locations: Wuhan, Shanghai; Working Language: Mandarin Chinese2. Remote work is accepted and supported;3. Salary will be commensurate with experience and finalized in accordance with the company's compensation structure and grading system.