Packaging Design Engineer: Substrate Layout & Interconnects
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A leading technology firm is seeking a Silicon Packaging Design Engineer in Phoenix, Arizona. This role involves end-to-end development of substrate designs, collaboration with silicon and hardware teams, and ensuring optimal cost efficiency and manufacturability. Ideal candidates will have a relevant Bachelor's or Master's degree and 1+ years of experience in microelectronic package design or PCB layout. Responsibilities include driving design layout, analyzing data, and ensuring quality standards are met. Competitive compensation and benefits are offered.
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