Advanced Packaging Engineer

Job ID: 2617366Location: Crane, IN, USDate Posted: 2026-09-29Category: Engineering and SciencesSubcategory: Mechanical EngrSchedule: Full-TimeShift: Day JobTravel: NoMinimum Clearance Required: Interim_SecretClearance Level Must Be Able to Obtain: SecretPotential for Remote Work: ORA_ON_SITEDescriptionSAIC is seeking a talented and motivated Advanced Packaging Engineer to support cutting-edge missile system hardware design and analysis efforts. In this role, you will collaborate with multidisciplinary engineering teams to develop, analyze, and validate advanced microelectronics packaging solutions for complex defense systems.JOB RESPONSIBILITES:Support mechanical design and analysis of missile system hardware and microelectronics packaging and assemblyPerform mechanical modeling and simulation activities, including finite element analysis (FEA), thermal fatigue, shock and vibration analysis, and MATLAB-based modelingApply systems engineering principles throughout all stages of the product lifecycle, including requirement development, verification, and validationParticipate in and support Systems Engineering Technical Reviews, including System Requirements Reviews (SRR), Preliminary Design Reviews (PDR), Critical Design Reviews (CDR), and Production Readiness Reviews (PRR)Collaborate with design teams to facilitate and document design development activitiesSupport Technical Interchange Meetings (TIMs) and contribute to cross-functional team discussionsAnalyze solder interconnect technologies, including Ball Grid Array (BGA), Column Grid Array (CGA), Flip-Chip, and J-lead packagesConduct experimental test and evaluation activities, including solder fatigue analysis and material property evaluationsClearly communicate technical findings, analyses, and recommendations to a wide range of audiences, including both technical and non-technical stakeholdersQualificationsREQUIRED EDUCATION AND EXPERIENCE:Bachelor's degree in Mechanical or Aerospace EngineeringWe are looking to hire two candidates at different levels:3+ years experience with mechanical modeling and simulation (e.g., FEA/ANSYS, MATLAB, vibration, shock, thermal fatigue)10+ years experience with mechanical modeling and simulation (e.g., FEA/ANSYS, MATLAB, vibration, shock, thermal fatigue)Experience with or knowledge of systems engineering principlesInterim secret clearance is required to start with the ability to obtain a secret clearance. SAIC will sponsor the clearance processMust be a US citizenPREFERRED EXPERIENCE:Experience with missile system hardware design and analysisFamiliarity with microelectronics packaging and assembly, including solder interconnect technologies