Senior Engineering Lead: Microelectronics Packaging & 3D

RTX is seeking a multi-disciplinary Engineering Project Leader for Advanced Technology to shape a microelectronics packaging portfolio using 2.5D/3D heterogeneous integration. You will drive program capture, lead IRAD/CRAD activities, and coordinate across Raytheon teams. This onsite role can be based in TEWKSBURY, MA; McKinney, TX; or Goleta, CA. Active TS clearance required. Join a world-class engineering community solving complex challenges and delivering high-impact projects. #J-18808-Ljbffr